Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield - Couverture rigide

Harman, George

Couverture rigide

ISBN 10 : 0070326193 ISBN 13 : 9780070326194

Editeur : McGraw-Hill Professional, 1997

Synopsis

This is the classic reference on wire bonding - expanded and updated! "Wire Bonding in Microelectronics Second Edition" the definitive single-volume reference on wire bonding just got better - in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies. Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. The book explains it all, with special emphasis on fine pitch bonding, bonding to MCMs, and additional areas that have been developed since the first edition was published.Readers will learn to: understand the bonding technology; test wire bonds; make reliable bonds at a very high yield; bond wires to multichip modules; solve common bonding problems; evaluate alternative bonding technologies; and, improve bondability and reliability via more effective cleaning techniques.

A propos du livre

À propos de l?auteur

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Détails de l'édition

• Éditeur: McGraw-Hill Professional
• Date d'édition: 1997
• Langue: anglais
• ISBN 10: 0070326193
• ISBN 13: 9780070326194
• Reliure: Relié
• Numéro d'édition: 2
• Nombre de pages: 290
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible