Materials for Electronic Packaging - Couverture souple

Chung, Deborah D. L.

Couverture souple

ISBN 10 : 0123992672 ISBN 13 : 9780123992673

Editeur : Butterworth-Heinemann, 2011

A propos du livre

Présentation de l'éditeur :

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Biographie de l'auteur :

Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

À propos de cette édition

• Éditeur: Butterworth-Heinemann
• Date d'édition: 2011
• ISBN 10: 0123992672
• ISBN 13: 9780123992673
• Reliure: Broché
• Nombre de pages: 388