Articles liés à Structural Analysis of Printed Circuit Board Systems

Structural Analysis of Printed Circuit Board Systems - Couverture rigide

Livre 28 sur 78: Mechanical Engineering

Engel, Peter A

 
9780387979397: Structural Analysis of Printed Circuit Board Systems
Couverture rigide
ISBN 10 : 0387979395 ISBN 13 : 9780387979397
Editeur : Springer-Verlag New York Inc., 1993

Synopsis

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de la quatrième de couverture

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Springer-Verlag New York Inc.
Date d'édition
1993
Langue
anglais
ISBN 10 
0387979395
ISBN 13 
9780387979397
Reliure
Relié
Nombre de pages
291
Coordonnées du fabricant
ProductSafety@springernature.com
ProductSafety@springernature.com

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