Vertical 3D Memory Technologies - Couverture rigide

Prince, Betty

Couverture rigide

ISBN 10 : 1118760514 ISBN 13 : 9781118760512

Editeur : John Wiley & Sons Inc, 2014

A propos du livre

Revue de presse :

In summary, Betty Prince has produced a piece of workthat is timely and will undoubtedly become a classic text for 3Dmemory technologies.   ( 3dincites.com , 30September 2014) "As the semiconductor memory industry moves to the thirddimension a plethora of competing technologies has arisen eachclaiming to be the logical, lucrative successor to existing twodimensional versions. The very breadth of these new technologiescan be confusing even to experienced industry professionals. DrPrince′s book appears at the right time to remove this confusion byexplaining each technology′s structure, function and potentialadvantages in a way that is accessible to both interestedspectators and those working in the industry. It provides a welcomesolid foundation to anyone interested in understanding the varioustechnologies vying for success in this migration. Andrew Walker, Schiltron Corporation, USA   This is a great review on the current state–of–the–art inthe highly topical subject of vertical 3D memories. It comprisesthe challenges and current solutions of 3D memory integration withrespective to different memory technologies. It is a highlyvaluable resource for researchers and engineers in the field ofmemory technology. Dr. Stephan Menzel, Forschungszentrum Jülich(PGI–7), Germany . one to consider if you want to bring yourself up tospeed on recent research behind today s and tomorrow s3D memory technologies. The book provides capsule summaries of over360 papers and articles from scholarly journals organized intosections of related technologies to provide an invaluable referenceon a particular 3D technology.  It s a useful tool forlocating research covering any of the numerous 3D technologies thatare now finding their way into early production. ­ Jim Handy, TheMemoryGuy.com,OBJECTIVE ANALYSIS Semiconductor Market Research, USA

Présentation de l'éditeur :

The large scale integration and planar scaling of individualsystem chips is reaching an expensive limit. If individual chipsnow, and later terrabyte memory blocks, memory macros, andprocessing cores, can be tightly linked in optimally designed andprocessed small footprint vertical stacks, then performance can beincreased, power reduced and cost contained. This book reviews forthe electronics industry engineer, professional and student thecritical areas of development for 3D vertical memory chipsincluding: gate–all–around and junction–less nanowire memories,stacked thin film and double gate memories,  terrabit verticalchannel and vertical gate stacked NAND flash, large scale stackingof  Resistance RAM cross–point arrays, and 2.5D/3D stacking ofmemory and processor chips with through–silicon–via connections now and remote links later.

Key features:

• Presents a review of the status and trends in 3–dimensionalvertical memory chip technologies.
• Extensively reviews advanced vertical memory chip technologyand development
• Explores technology process routes and 3D chip integration in asingle reference

À propos de cette édition

• Éditeur: John Wiley & Sons Inc
• Date d'édition: 2014
• ISBN 10: 1118760514
• ISBN 13: 9781118760512
• Reliure: Relié
• Nombre de pages: 368