Articles liés à Physical Design for Multichip Modules
- ÉditeurSpringer
- Date d'édition1994
- ISBN 10 1461361532
- ISBN 13 9781461361534
- ReliureBroché
- Nombre de pages216
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Physical Design for Multichip Modules
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided. N° de réf. du vendeur 9781461361534
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Physical Design for Multichip Modules (The Springer International Series in Engineering and Computer Science, 267)
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Physical Design for Multichip Modules
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Physical Design for Multichip Modules
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Physical Design for Multichip Modules
Vendeur : GreatBookPricesUK, Castle Donington, DERBY, Royaume-Uni
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Physical Design for Multichip Modules
impression à la demandeVendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided. 216 pp. Englisch. N° de réf. du vendeur 9781461361534
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Physical Design for Multichip Modules (The Springer International Series in Engineering and Computer Science) by Sriram, Mysore [Paperback ]
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Soft Cover. Etat : new. N° de réf. du vendeur 9781461361534
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Physical Design for Multichip Modules
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well . N° de réf. du vendeur 4194349
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Physical Design for Multichip Modules
Vendeur : Books Puddle, New York, NY, Etats-Unis
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Etat : New. pp. 216. N° de réf. du vendeur 2697841498
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Physical Design for Multichip Modules
impression à la demandeVendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. Print on Demand pp. 216 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam. N° de réf. du vendeur 94588549
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