Articles liés à Power Electronic Packaging: Design, Assembly Process,...
Synopsis
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Autres éditions populaires du même titre
Résultats de recherche pour Power Electronic Packaging: Design, Assembly Process,...
Image d'archives
Liu:Power Electronic Packaging (eng)
Edité par
Springer Science & Business Media, 2012
ISBN 10 : 1461410525
ISBN 13 : 9781461410522
Neuf
Couverture rigide
Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie
Évaluation du vendeur 5 sur 5 étoiles
Etat : new. Questo è un articolo print on demand. N° de réf. du vendeur 7576fee17d3e084a912d18807cd8aa1a
Acheter neuf
EUR 206,31
Expédition à EUR 11
Expédition depuis Italie vers Etats-Unis
Expédition depuis Italie vers Etats-Unis
Quantité disponible : Plus de 20 disponibles
Image d'archives
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. In. N° de réf. du vendeur ria9781461410522_new
Acheter neuf
EUR 251,41
Expédition à EUR 13,96
Expédition depuis Royaume-Uni vers Etats-Unis
Expédition depuis Royaume-Uni vers Etats-Unis
Quantité disponible : Plus de 20 disponibles
Image fournie par le vendeur
Power Electronic Packaging
Edité par
Springer New York, 2012
ISBN 10 : 1461410525
ISBN 13 : 9781461410522
Neuf
Couverture rigide
Vendeur : moluna, Greven, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting. N° de réf. du vendeur 4197007
Acheter neuf
EUR 223,97
Expédition à EUR 48,99
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : Plus de 20 disponibles
Image fournie par le vendeur
Power Electronic Packaging
Edité par
Springer-Verlag Gmbh Feb 2012, 2012
ISBN 10 : 1461410525
ISBN 13 : 9781461410522
Neuf
Couverture rigide
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices. 591 pp. Englisch. N° de réf. du vendeur 9781461410522
Acheter neuf
EUR 267,49
Expédition à EUR 23
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 2 disponible(s)
Image fournie par le vendeur
Power Electronic Packaging
Edité par
Springer New York, Springer US Feb 2012, 2012
ISBN 10 : 1461410525
ISBN 13 : 9781461410522
Neuf
Couverture rigide
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection soreaders can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book alsocovers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates themost recenttrends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 612 pp. Englisch. N° de réf. du vendeur 9781461410522
Acheter neuf
EUR 267,49
Expédition à EUR 60
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 1 disponible(s)
Image fournie par le vendeur
Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling
Edité par
Springer New York, Springer US, 2012
ISBN 10 : 1461410525
ISBN 13 : 9781461410522
Neuf
Couverture rigide
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices. N° de réf. du vendeur 9781461410522
Acheter neuf
EUR 275,87
Expédition à EUR 65,37
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 1 disponible(s)
Image d'archives
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Edité par
Springer, 2012
ISBN 10 : 1461410525
ISBN 13 : 9781461410522
Ancien ou d'occasion
Couverture rigide
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Évaluation du vendeur 4 sur 5 étoiles
Hardcover. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book. N° de réf. du vendeur ERICA77314614105256
Acheter D'occasion
EUR 316,78
Expédition à EUR 29,12
Expédition depuis Royaume-Uni vers Etats-Unis
Expédition depuis Royaume-Uni vers Etats-Unis
Quantité disponible : 1 disponible(s)
Image d'archives
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Vendeur : Revaluation Books, Exeter, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Hardcover. Etat : Brand New. 591 pages. 9.50x6.50x1.50 inches. In Stock. N° de réf. du vendeur x-1461410525
Acheter neuf
EUR 385,16
Expédition à EUR 17,47
Expédition depuis Royaume-Uni vers Etats-Unis
Expédition depuis Royaume-Uni vers Etats-Unis
Quantité disponible : 2 disponible(s)