Description du livre Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting. N� de r�f. du vendeur 4197007

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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Liu, Yong

Edit� par Springer (2012)

ISBN 10 : 1461410525 ISBN 13 : 9781461410522

Neuf Couverture rigide Quantit� disponible : 1

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GF Books, Inc.
(Hawthorne, CA, Etats-Unis)

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Description du livre Etat : New. Book is in NEW condition. N� de r�f. du vendeur 1461410525-2-1

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Power Electronic Packaging

Yong Liu

Edit� par Springer-Verlag Gmbh Feb 2012 (2012)

ISBN 10 : 1461410525 ISBN 13 : 9781461410522

Neuf Couverture rigide Quantit� disponible : 2

impression � la demande

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BuchWeltWeit Ludwig Meier e.K.
(Bergisch Gladbach, Allemagne)

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Description du livre Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices. 591 pp. Englisch. N� de r�f. du vendeur 9781461410522

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Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling

Yong Liu

Edit� par Springer-Verlag Gmbh (2012)

ISBN 10 : 1461410525 ISBN 13 : 9781461410522

Neuf Couverture rigide Quantit� disponible : 1

Vendeur :

AHA-BUCH GmbH
(Einbeck, Allemagne)

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Description du livre Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices. N� de r�f. du vendeur 9781461410522

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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Liu, Yong

Edit� par Springer (2012)

ISBN 10 : 1461410525 ISBN 13 : 9781461410522

Neuf Couverture rigide Quantit� disponible : 1

Vendeur :

Book Deals
(Tucson, AZ, Etats-Unis)

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Description du livre Etat : New. New! This book is in the same immaculate condition as when it was published. N� de r�f. du vendeur 353-1461410525-new

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