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Description du livre Hardcover. Etat : new. N° de réf. du vendeur 9783319204802
Description du livre Etat : New. N° de réf. du vendeur ABLIING23Mar3113020090759
Description du livre Etat : New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. N° de réf. du vendeur ria9783319204802_lsuk
Description du livre Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. 364 pp. Englisch. N° de réf. du vendeur 9783319204802
Description du livre Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. N° de réf. du vendeur 9783319204802
Description du livre Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systemsExplains the use of wireless 3D integration to improve 3D IC reliability and yieldDescribes techniques for monitoring a. N° de réf. du vendeur 31406386
Description du livre Etat : New. Editor(s): Elfadel, Ibrahim M.; Fettweis, Gerhard. Num Pages: 214 pages, 193 black & white illustrations, 85 colour illustrations, 22 black & white tables, 193 co. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155. . . 2016. 1st ed. 2016. Hardcover. . . . . Books ship from the US and Ireland. N° de réf. du vendeur V9783319204802
Description du livre Etat : New. Editor(s): Elfadel, Ibrahim M.; Fettweis, Gerhard. Num Pages: 214 pages, 193 black & white illustrations, 85 colour illustrations, 22 black & white tables, 193 co. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155. . . 2016. 1st ed. 2016. Hardcover. . . . . N° de réf. du vendeur V9783319204802