Handbook of Advanced Plasma Processing Techniques - Couverture souple

9783642630965: Handbook of Advanced Plasma Processing Techniques

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ISBN 10 : 3642630960 ISBN 13 : 9783642630965

Editeur : Springer-Verlag Berlin and Heidelberg GmbH & Co. K, 2012

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The ability to make small features in Si, metals, dielectrics and other materials is what has enabled rapid advances in computing, communications, aeronautics and all other technologies that depend on microelectronics, miniature sensors and actuators and magnetic data storage. Plasma techniques enable the fine control and accurate pattern transfer and thus are central to our technology age.

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�diteur: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Date d'�dition: 2012
Langue: anglais
ISBN 10: 3642630960
ISBN 13: 9783642630965
Reliure: Broch�
Nombre de pages: 671
�diteur: Shul R.J., Pearton S.J.
Coordonn�es du fabricant: non disponible
Personne responsable: CMN Printpool Inh. Mathis Neumann
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Handbook of Advanced Plasma Processing Techniques (eng)

Shul, R.J.

Edit� par Springer, 2012

ISBN 10 : 3642630960 ISBN 13 : 9783642630965

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Handbook of Advanced Plasma Processing Techniques

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Handbook of Advanced Plasma Processing Techniques

Shul, Randy J.|Pearton, Stephen J.

Edit� par Springer Berlin Heidelberg, 2012

ISBN 10 : 3642630960 ISBN 13 : 9783642630965

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Handbook of Advanced Plasma Processing Techniques

S. J. Pearton

Edit� par Springer Berlin Heidelberg, Springer Berlin Heidelberg Nov 2012, 2012

ISBN 10 : 3642630960 ISBN 13 : 9783642630965

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed 'trial-and-error' approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved. 672 pp. Englisch. N� de r�f. du vendeur 9783642630965

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Handbook of Advanced Plasma Processing Techniques

R. J. Shul

Edit� par Springer, Springer Vieweg Nov 2012, 2012

ISBN 10 : 3642630960 ISBN 13 : 9783642630965

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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -The ability to make small features in Si, metals, dielectrics and other materials is what has enabled rapid advances in computing, communications, aeronautics and all other technologies that depend on microelectronics, miniature sensors and actuators and magnetic data storage. Plasma techniques enable the fine control and accurate pattern transfer and thus are central to our technology age.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 672 pp. Englisch. N� de r�f. du vendeur 9783642630965

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Handbook of Advanced Plasma Processing Techniques

R. J. Shul

Edit� par Springer, Springer Vieweg, 2012

ISBN 10 : 3642630960 ISBN 13 : 9783642630965

Neuf Taschenbuch

Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed 'trial-and-error' approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved. N� de r�f. du vendeur 9783642630965

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