folberth warren grobman (7 résultats)

Hardcover. Etat : Très bon. Ancien livre de bibliothèque. Edition 1984. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 1984. Ammareal gives back up to 15% of this item's net price to charity organizations.

Etat : Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,850grams, ISBN:0879421800.

309 S. mit zahlreichen Abbildungen, (309 pp. with a lot of figures), 0879421800 Sprache: Englisch Gewicht in Gramm: 820 Groß 8°, (large 8vo), Original-Pappband (Hardcover), Bibliotheks-Exemplar (Privatbibliothek) mit 2 kleinen Rückenschildern, Stempel auf Titel und auf Schnitt Einband minimal lichtrandig, insgesamt gutes und innen sauberes Exemplar, (library copy in good condition),

Hardcover. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Spine sunned. A couple tiny spots on rear board. Else binding clean. Light bumping on bottom edges of a few pages. Staining on edges of a few pages. Else pages clean, but for library markings. ; TEH22A; 309 pages; Ex-Library.

Illustrated Coated Boards. Etat : Very Good. No Jacket. Let's see if we can sort this out. In 1983 the IEEE produced two special issues, "Micron ansd Submicron Circuit Engineering," and "VLSI Design: Problems and Tools." The contents of those issues, with the exception of two un-named papers that were considered "too specialized for the envisaged broader readership," have been republished in this publication. Addtionally the co-editors, both associated with IBM, contributed an original paper each, to bring the final number of papers back to where it began. The 25 papers - 23 reprinted, two new - have been grouped under the following topics: Overview; Lithography; Devices and Processes; Micron and Submicron Circuit Engineering - Digital and Analog Applications and Results; Modeling and Simulation of Devices and Circuits; Design Methodologies and Testing of VLSI Chips; International Aspects; and Outlook. 309 pages, with tables, figures, half-tones, Author Index, Subject Index, and Editor's Biographies; plus ix pages, Contents, Preface, and (editors') Foreword; References at the end of each paper. Covers insignificantly bumped at lower corners, otherwise clean and sound; text is clean and strong.

Hardcover. Etat : UsedVeryGood. Hardcover; light fading, light shelf wear to exterior; inside front board is an inscription by one of the editors to a friend; very good condition with clean text, firm binding.

Etat : VG. NY 1984 1st Institute of Electrical And Electronics Engineers. 4to, 309pp., printed boards. VG.