Description du livre Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well . N� de r�f. du vendeur 5971497

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Physical Design for Multichip Modules

Sung-Mo (Steve) Kang

Edit� par Springer US (1994)

ISBN 10 : 079239450X ISBN 13 : 9780792394501

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AHA-BUCH GmbH
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Description du livre Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided. N� de r�f. du vendeur 9780792394501

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Physical Design for Multichip Modules

Sriram, Mysore, Sung-Mo (Steve) Kang

Edit� par Springer (1994)

ISBN 10 : 079239450X ISBN 13 : 9780792394501

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Kennys Bookshop and Art Galleries Ltd.
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Description du livre Etat : New. N� de r�f. du vendeur V9780792394501

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Physical Design for Multichip Modules

Sung-Mo (Steve) Kang

Edit� par Springer US Mrz 1994 (1994)

ISBN 10 : 079239450X ISBN 13 : 9780792394501

Neuf Couverture rigide Quantit� disponible : 2

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BuchWeltWeit Ludwig Meier e.K.
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Description du livre Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided. 218 pp. Englisch. N� de r�f. du vendeur 9780792394501

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