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Lead Free Solder: Interfacial Reaction between Sn-37Pb and Sn-4Ag-0.5Cu Solders on Different Surface Finishes - Couverture souple
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Présentation de l'éditeur :
The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition.
Biographie de l'auteur :
Dr Azmah Hanim was born in Penang, Malaysia. She obtained her PhD in Mechanical Engineering from University Technology Malaysia in 2008. After working as a senior material technology development engineer in Intel, she joined University Putra Malaysia as a senior lecturer. Her current research interest is on lead free soldering reliability.
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- ÉditeurLAP Lambert Academic Publishing
- Date d'édition2013
- ISBN 10 3659379484
- ISBN 13 9783659379482
- ReliureBroché
- Nombre de pages272
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Lead Free Solder: Interfacial Reaction between Sn-37Pb and Sn-4Ag-0.5Cu Solders on Different Surface Finishes
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LAP LAMBERT Academic Publishing
(2013)
ISBN 10 : 3659379484
ISBN 13 : 9783659379482
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Couverture souple
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Description du livre Etat : New. N° de réf. du vendeur ABLIING23Mar3113020282112
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Lead Free Solder
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Description du livre Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition. 272 pp. Englisch. N° de réf. du vendeur 9783659379482
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Lead Free Solder
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ISBN 10 : 3659379484
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Lead Free Solder Interfacial Reaction between Sn37Pb and Sn4Ag05Cu Solders on Different Surface Finishes
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Lead Free Solder : Interfacial Reaction between Sn-37Pb and Sn-4Ag-0.5Cu Solders on Different Surface Finishes
Edité par
LAP LAMBERT Academic Publishing
(2013)
ISBN 10 : 3659379484
ISBN 13 : 9783659379482
Neuf
Taschenbuch
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Evaluation vendeur
Description du livre Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition. N° de réf. du vendeur 9783659379482
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EUR 74,90
Autre devise
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Lead Free Solder
Edité par
LAP LAMBERT Academic Publishing
(2013)
ISBN 10 : 3659379484
ISBN 13 : 9783659379482
Neuf
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Description du livre Kartoniert / Broschiert. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Mohamed Ariff Azmah HanimDr Azmah Hanim was born in Penang, Malaysia. She obtained her PhD in Mechanical Engineering from University Technology Malaysia in 2008. After working as a senior material technology development engineer in I. N° de réf. du vendeur 5152344
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Lead Free Solder Interfacial Reaction between Sn37Pb and Sn4Ag05Cu Solders on Different Surface Finishes
Edité par
LAP LAMBERT Academic Publishing
(2013)
ISBN 10 : 3659379484
ISBN 13 : 9783659379482
Neuf
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Description du livre PAP. Etat : New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. N° de réf. du vendeur L0-9783659379482
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