Edité par LAP LAMBERT Academic Publishing, 2013
ISBN 10 : 3659379484 ISBN 13 : 9783659379482
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
Etat : New.
Edité par LAP LAMBERT Academic Publishing, 2013
ISBN 10 : 3659379484 ISBN 13 : 9783659379482
Vendeur : PBShop.store UK, Fairford, GLOS, Royaume-Uni
PAP. Etat : New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Edité par LAP LAMBERT Academic Publishing, 2013
ISBN 10 : 3659379484 ISBN 13 : 9783659379482
Vendeur : PBShop.store US, Wood Dale, IL, Etats-Unis
PAP. Etat : New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Edité par LAP LAMBERT Academic Publishing, 2013
ISBN 10 : 3659379484 ISBN 13 : 9783659379482
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition.
Edité par LAP LAMBERT Academic Publishing, 2013
ISBN 10 : 3659379484 ISBN 13 : 9783659379482
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Paperback. Etat : Like New. Like New. book.