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Edité par Springer, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : booksXpress, Bayonne, NJ, Etats-Unis
Livre
Soft Cover. Etat : new.
Edité par Springer, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
Livre
Etat : New.
Edité par Springer, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Livre impression à la demande
Etat : New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Edité par Springer 2012-09, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : Chiron Media, Wallingford, Royaume-Uni
Livre
PF. Etat : New.
Edité par Springer US Sep 2012, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Livre impression à la demande
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging. 276 pp. Englisch.
Edité par Springer US, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : moluna, Greven, Allemagne
Livre impression à la demande
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. About five to six years ago, the words packaging and manufacturing started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provi.
Edité par Springer US, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Livre
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Edité par Springer-Verlag New York Inc., 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
Livre impression à la demande
Paperback / softback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Edité par Springer, 2012
ISBN 10 : 1461376599ISBN 13 : 9781461376590
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Livre
Paperback. Etat : Like New. Like New. book.