Articles liés à Manufacturing Challenges in Electronic Packaging
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This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
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- ÉditeurSpringer
- Date d'édition2012
- ISBN 10 1461376599
- ISBN 13 9781461376590
- ReliureBroché
- Nombre de pages276
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Manufacturing Challenges in Electronic Packaging [Paperback ]
Edité par
Springer
(2012)
ISBN 10 : 1461376599
ISBN 13 : 9781461376590
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Description du livre Soft Cover. Etat : new. N° de réf. du vendeur 9781461376590
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Manufacturing Challenges in Electronic Packaging
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Description du livre Etat : New. N° de réf. du vendeur ABLIING23Mar2716030034108
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Manufacturing Challenges in Electronic Packaging
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Description du livre Etat : New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. N° de réf. du vendeur ria9781461376590_lsuk
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Manufacturing Challenges in Electronic Packaging
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PF
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Description du livre PF. Etat : New. N° de réf. du vendeur 6666-IUK-9781461376590
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Manufacturing Challenges in Electronic Packaging
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(2012)
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ISBN 13 : 9781461376590
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Description du livre Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging. 276 pp. Englisch. N° de réf. du vendeur 9781461376590
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Manufacturing Challenges in Electronic Packaging
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Springer US
(2012)
ISBN 10 : 1461376599
ISBN 13 : 9781461376590
Neuf
Couverture souple
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Description du livre Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. About five to six years ago, the words packaging and manufacturing started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provi. N° de réf. du vendeur 4195786
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Manufacturing Challenges in Electronic Packaging
Edité par
Springer US
(2012)
ISBN 10 : 1461376599
ISBN 13 : 9781461376590
Neuf
Taschenbuch
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Description du livre Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging. N° de réf. du vendeur 9781461376590
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EUR 109,42
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Manufacturing Challenges in Electronic Packaging
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Springer-Verlag New York Inc.
(2012)
ISBN 10 : 1461376599
ISBN 13 : 9781461376590
Neuf
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Description du livre Paperback / softback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days. N° de réf. du vendeur C9781461376590
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