Manufacturing challenges electronic packaging (32 résultats)

Hardcover. Etat : Very Good. No Dust Jacket. Library stamps/marks/labels, otherwise light wear. Crisp hardcover. ; Ex-Library; 272 pages.

Etat : New.

Etat : New.

Etat : New.

Etat : New.

Etat : New. In English.

Etat : New. In English.

Etat : New. Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected. Editor(s): Lee, Y. C.; Chen, W.T.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 17. Weight in Grams: 565. . 1997. 1998th Edition. hardcover. . . . . …

Etat : New. pp. 276.

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.…

Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.…

Taschenbuch. Etat : Neu. Manufacturing Challenges in Electronic Packaging | Y. C. Lee (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9781461376590 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Etat : New. pp. 276.

Etat : New. Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected. Editor(s): Lee, Y. C.; Chen, W.T.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 17. Weight in Grams: 565. . 1997. 1998th Edition. hardcover. . . . . Books ship from the US and Ireland. …

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Hardcover. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

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Etat : new. Questo è un articolo print on demand.

PF. Etat : New. This item is printed on demand. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging. 276 pp. Englisch.…

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. About five to six years ago, the words packaging and manufacturing started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provi.…

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. About five to six years ago, the words packaging and manufacturing started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provi.…

Buch. Etat : Neu. Manufacturing Challenges in Electronic Packaging | W. T. Chen (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 1997 | Springer US | EAN 9780412620300 | Verantwortliche Person für die EU: Springer Heidelberg, Tiergartenstr. 17, 69121 Heidelberg, buchhandel-buch[at]springer[dot]com | Anbieter: preigu Print on Demand. …

Etat : New. Print on Demand pp. 276 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Buch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 284 pp. Englisch.…

Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 276 pp. Englisch.…

Etat : New. PRINT ON DEMAND pp. 276.

Etat : New. Print on Demand pp. 276 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.