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Edité par Cham, Springer International Publishing., 2015
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : Antiquariat im Hufelandhaus GmbH vormals Lange & Springer, Berlin, Allemagne
Livre
Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Edité par Cham, Springer International Publishing., 2015
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Livre
Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Edité par Springer, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : booksXpress, Bayonne, NJ, Etats-Unis
Livre
Hardcover. Etat : new.
Edité par Springer, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
Livre
Etat : New.
Edité par Springer, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Livre impression à la demande
Etat : New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Edité par Springer International Publishing Mai 2016, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Livre impression à la demande
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. 364 pp. Englisch.
Edité par Springer International Publishing, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Livre
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Edité par Springer International Publishing, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : moluna, Greven, Allemagne
Livre impression à la demande
Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systemsExplains the use of wireless 3D integration to improve 3D IC reliability and yieldDescribes techniques for monitoring a.
Edité par Springer, 2016
ISBN 10 : 3319204807ISBN 13 : 9783319204802
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Livre
Hardcover. Etat : Like New. Like New. book.