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Synopsis
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
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À propos de l?auteur
Ibrahim (Abe) M. Elfadel has 15 years of industrial experience in the research, development and deployment of advanced computer-aided design (CAD) tools and methodologies for deep-submicron, high-performance digital designs. Most recently, he played a key role in the development and deployment of IBM's next-generation layout verification tools for the ultra-deep submicron CMOS technology nodes. Dr. Elfadel is the recipient of six Invention Achievement Awards, an Outstanding Technical Achievement Award and a Research Division Award, all from IBM, for his contributions in the area of VLSI CAD. He is currently serving as an Associate Editor for the IEEE Transactions on Computer-Aided Design for Integrated Circuits and Systems.
Gerhard Fettweis earned his Ph.D. under H. Meyr's supervision from RWTH Aachen in 1990. After one year at IBM Research in San Jose, CA he moved to TCSI Inc., Berkeley, CA. Since 1994 he is Vodafone Chair Professor at TU Dresden, Germany, with currently 20 companies from Asia/Europe/US sponsoring his research on wireless transmission and chip design. He coordinates 2 DFG centers at TU Dresden, cfAED and HAEC. Gerhard is IEEE Fellow, member of acatech, has an honorary doctorate from TU Tampere, and has received multiple awards. In Dresden he has spun-out ten start-ups, and setup funded projects of more than EUR 1/3 billion volume. He has helped organized IEEE conferences, most notably as TPC Chair of IEEE ICC 2009, IEEE TTM 2012, and Ge
neral Chair of VTC Spring 2013. He remains active within IEEE.Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
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3D Stacked Chips. From Emerging Processes to Heterogeneous Systems.
Edité par
Cham, Springer International Publishing., 2015
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
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Vendeur : Universitätsbuchhandlung Herta Hold GmbH, Berlin, Allemagne
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Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch. N° de réf. du vendeur 10989DB
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3D Stacked Chips
Edité par
Springer International Publishing, 2016
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systemsExplains the use of wireless 3D integration to improve 3D IC reliability and yieldDescribes techniques for monitoring a. N° de réf. du vendeur 31406386
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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems
Edité par
Springer International Publishing, 2016
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
Neuf
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Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
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Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. N° de réf. du vendeur 9783319204802
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3D Stacked Chips
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Springer International Publishing Mai 2016, 2016
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
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Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. 364 pp. Englisch. N° de réf. du vendeur 9783319204802
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Etat : New. In. N° de réf. du vendeur ria9783319204802_new
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3D Stacked Chips
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
Neuf
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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
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Buch. Etat : Neu. Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 364 pp. Englisch. N° de réf. du vendeur 9783319204802
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3d Stacked Chips : From Emerging Processes to Heterogeneous Systems
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Etat : New. N° de réf. du vendeur 23901063-n
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3D Stacked Chips
Edité par
Springer International Publishing AG, CH, 2016
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
Neuf
Couverture rigide
Vendeur : Rarewaves.com UK, London, Royaume-Uni
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Hardback. Etat : New. 1st ed. 2016. This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. N° de réf. du vendeur LU-9783319204802
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3d Stacked Chips : From Emerging Processes to Heterogeneous Systems
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Etat : New. N° de réf. du vendeur 23901063-n
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3D Stacked Chips
Edité par
Springer International Publishing AG, CH, 2016
ISBN 10 : 3319204807
ISBN 13 : 9783319204802
Neuf
Couverture rigide
Vendeur : Rarewaves.com USA, London, LONDO, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Hardback. Etat : New. 1st ed. 2016. This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. N° de réf. du vendeur LU-9783319204802
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