Description du livre Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. 364 pp. Englisch. N� de r�f. du vendeur 9783319793054

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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems

Gerhard Fettweis

Edit� par Springer International Publishing (2018)

ISBN 10 : 3319793055 ISBN 13 : 9783319793054

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AHA-BUCH GmbH
(Einbeck, Allemagne)

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Description du livre Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. N� de r�f. du vendeur 9783319793054

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3D Stacked Chips

Elfadel, Ibrahim (Abe) M.|Fettweis, Gerhard

Edit� par Springer International Publishing (2018)

ISBN 10 : 3319793055 ISBN 13 : 9783319793054

Neuf Couverture souple Quantit� disponible : > 20

impression � la demande

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moluna
(Greven, Allemagne)

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Description du livre Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systemsExplains the use of wireless 3D integration to improve 3D IC reliability and yieldDescribes techniques for monitoring a. N� de r�f. du vendeur 448754751

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