Multichip Modules and Related Technologies: McM, Tab, and Cob Design - Couverture rigide

Ginsberg, Gerald L.; Schnorr, Donald

Couverture rigide

ISBN 10 : 007023552X ISBN 13 : 9780070235526

Editeur : McGraw-Hill Inc.,US, 1994

Synopsis

Surface mount technology (SMT) revolutionized the electronic packaging field in the 80s. Now - while many manufacturers are still rushing to retool for SMT - three new technologies are taking the industry by storm: multichip module (MCM), tape automated bonding (TAB), and chip on board (COB) packaging. Capable of producing results that are 50% lighter, 50% smaller, and 50% cheaper than SMT, these leading-edge technologies are bound to have an enormous impact on a broad spectrum of applications - from aerospace and communications to advanced computer and control technologies. Providing complete coverage of all design and manufacturing issues as well as end-product applications, this book shows how to take part in the packaging revolution of the 90s.

Détails de l'édition

• Éditeur: McGraw-Hill Inc.,US
• Date d'édition: 1994
• Langue: anglais
• ISBN 10: 007023552X
• ISBN 13: 9780070235526
• Reliure: Relié
• Nombre de pages: 290
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible