Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations.
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Vendeur : World of Books (was SecondSale), Montgomery, IL, Etats-Unis
Hardback. Etat : Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. N° de réf. du vendeur 00110862860
Quantité disponible : 1 disponible(s)
Vendeur : World of Books (was SecondSale), Montgomery, IL, Etats-Unis
Hardback. Etat : Very Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. N° de réf. du vendeur 00108949801
Quantité disponible : 1 disponible(s)
Vendeur : Better World Books, Mishawaka, IN, Etats-Unis
Etat : Good. 2nd Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. N° de réf. du vendeur 5907654-6
Quantité disponible : 1 disponible(s)
Vendeur : World of Books Inc, Montgomery, IL, Etats-Unis
Hardback. Etat : Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. N° de réf. du vendeur CIN0070266948G
Quantité disponible : 1 disponible(s)
Vendeur : World of Books Inc, Montgomery, IL, Etats-Unis
Hardback. Etat : Very Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. N° de réf. du vendeur CIN0070266948VG
Quantité disponible : 1 disponible(s)
Vendeur : Greenworld Books, Arlington, TX, Etats-Unis
Etat : very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy. N° de réf. du vendeur GWV.0070266948.VG
Quantité disponible : 1 disponible(s)
Vendeur : HPB-Red, Dallas, TX, Etats-Unis
hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! N° de réf. du vendeur S_386818827
Quantité disponible : 1 disponible(s)
Vendeur : ThriftBooks-Atlanta, AUSTELL, GA, Etats-Unis
Hardcover. Etat : Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. N° de réf. du vendeur G0070266948I3N00
Quantité disponible : 1 disponible(s)
Vendeur : ThriftBooks-Dallas, Dallas, TX, Etats-Unis
Hardcover. Etat : Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. N° de réf. du vendeur G0070266948I4N00
Quantité disponible : 1 disponible(s)
Vendeur : Orphans Treasure Box, Champaign, IL, Etats-Unis
Hardcover. Etat : Very Good. Ships quickly. Mild shelf/reading wear. Orphans Treasure Box sells books to raise money for orphans and vulnerable kids. N° de réf. du vendeur 2MG-10192021-169
Quantité disponible : 1 disponible(s)