Electronic Packaging of High Speed Circuitry - Couverture rigide

Konsowski, Stephen; Helland, Arden

Couverture rigide

ISBN 10 : 0070359709 ISBN 13 : 9780070359703

Editeur : McGraw-Hill Professional, 1997

Synopsis

Presenting guidelines for designing and packaging high-speed circuitry, this work details the role of materials selection and also covers manufacturing considerations.

A propos du livre

À propos de l'auteur

Stephen G. Konsowski has 34 years of electronic packaging engineering experience. Retired from Westinghouse as an an advisory engineer, he is now associated with Technology Seminars, Inc. of Lutherville, Maryland. He is a founding member of the Intenrational Electronics Packaging Society (IEPS) and one of its former directors. Mr. Konsowski has authored many technical papers and articles on electronic packaging, including a chapter for the Second Edition of McGraw-Hill's Handbook of Electronic Materials and Processes and Handbook of Packaging and Interconnection. Arden R. Helland is an advisory engineer at the Northrop Grumman Corporation's Electronic Sensors and Systems Division with over 35 years of experience in all phases of electrical design for advanced electronic systems. He is the author of the chapter on the reliability digital systems for the McGraw-Hill Computer Engineering Handbook.

Détails de l'édition

• Éditeur: McGraw-Hill Professional
• Date d'édition: 1997
• Langue: anglais
• ISBN 10: 0070359709
• ISBN 13: 9780070359703
• Reliure: Relié
• Nombre de pages: 345
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible