Multilevel Interconnect Technology - Couverture rigide

Rao, Gopal

Couverture rigide

ISBN 10 : 0070512248 ISBN 13 : 9780070512245

Editeur : McGraw-Hill Inc.,US, 1993

Synopsis

To compete in the marketplace, IC manufacturers must pack more and more transistors onto their chips in order to offer more features. To do so, they rely on multiple levels of IC interconnections - and this book should be useful to getting a head start in the technology. Designed for IC design, process, and manufacturing engineers, it's a step-by-step guide to manufacturing these complex devices in high volume with high yields. The author's approach, based on his professional experience at Intel, is practical, with the focus on problem solving. He uses easy-to-grasp tools to dissect and analyze each complex process into subsystems so the reader should gain an understanding of the issues.

Détails de l'édition

• Éditeur: McGraw-Hill Inc.,US
• Date d'édition: 1993
• Langue: anglais
• ISBN 10: 0070512248
• ISBN 13: 9780070512245
• Reliure: Relié
• Nombre de pages: 224
• Coordonnées du fabricant: non disponible
• Personne responsable: Buchpark GmbH; gpsr@buchpark.de; ; Krügerweg 1; Trebbin; Brandenburg; 14959; Allemagne