Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.
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Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
Vendeur : Vashon Island Books, Vashon, WA, Etats-Unis
Hardcover. Etat : Very Good+. Etat de la jaquette : No Dust Jacket. Second Edition. Signed and Inscribed By Author Ronald Sampson on free front endpaper: "To George Rudd, whose friendship has enriched my life. Ron Sampson - 4-7-94". Size: 8vo - over 7¾" - 9¾". Signed and Inscribed By Author. Book. N° de réf. du vendeur 0841662
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Hardcover. Etat : Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. N° de réf. du vendeur G0070542996I3N00
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Vendeur : ThriftBooks-Dallas, Dallas, TX, Etats-Unis
Hardcover. Etat : Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. N° de réf. du vendeur G0070542996I3N00
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Vendeur : Books From California, Simi Valley, CA, Etats-Unis
Hardcover. Etat : Very Good. N° de réf. du vendeur mon0003475589
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Vendeur : Better World Books Ltd, Dunfermline, Royaume-Uni
Etat : Good. 2nd Edition. Ships from the UK. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages. N° de réf. du vendeur GRP29997827
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Vendeur : BookDepart, Shepherdstown, WV, Etats-Unis
Hardcover. Etat : New. Hardcover, 2nd edition remainder; may have light scuffing to exterior as a result of warehouse storage. N° de réf. du vendeur 71000
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Vendeur : Red's Corner LLC, Tucker, GA, Etats-Unis
hardcover. Etat : New. All orders ship by next business day! This is a new book. We are a small company and very thankful for your business! N° de réf. du vendeur 4CNZE900000O
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Vendeur : Anybook.com, Lincoln, Royaume-Uni
Etat : Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780070542990. N° de réf. du vendeur 5826697
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Vendeur : The Book Spot, Sioux Falls, MN, Etats-Unis
Hardcover. Etat : New. N° de réf. du vendeur Abebooks18643
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