The toxic effects of lead are well known. The presence of dangerous lead levels in consumer electronic products like laptops and desktop computers, cell phones, palm pilots and cameras has been less publicized. Lead in electronics is now banned in Europe and Japan and market forces have created a defacto ban in North America. A ban on lead has severe consequences for microelectronics: lead replacements will have higher melting points and the higher temperatures required for packaging and manufacturing processes will affect printed circuit board finishes and materials, fluxes and the entire soldering process. Written by a global team of experts from key companies around the world (IBM, Cookson, Nokia), this book provides a tutorial and reference for electronics manufacturers currently beginning or already undergoing the lead-free conversion process, dealing with each effect the lead ban will have on microelectronics packaging and manufacturing. Spearheaded by IBM's industry-leading Corporate Lead Reduction operation, the book presents a complete technology programme for dealing with the necessitated switch to lead-free solders. It deals with both technology and market issues.
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
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