Articles liés à Failure-Free Integrated Circuit Packages: Systematic...

Failure-Free Integrated Circuit Packages: Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements - Couverture rigide

Cohn, Charles; Harper, Charles

 
9780071434843: Failure-Free Integrated Circuit Packages: Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements
Couverture rigide
ISBN 10 : 0071434844 ISBN 13 : 9780071434843
Editeur : McGraw-Hill Professional, 2004

Synopsis

The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos des auteurs

Charles Cohn is a Distinguished Member of Technical Staff in the IC Packaging and Interconnection Organization at Agere Systems. He has been with AT&T /Lucent/Agere for 21 years, and is currently lead technologist for Agere's operations in this field. He has conducts many seminars in advanced IC packaging and interconnection, the U.S. and overseas, and has been awarded ten US patents

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering, Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
McGraw-Hill Professional
Date d'édition
2004
Langue
anglais
ISBN 10 
0071434844
ISBN 13 
9780071434843
Reliure
Relié
Nombre de pages
366
Coordonnées du fabricant
non disponible
Personne responsable
non disponible