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While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
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Ken Gilleo, Ph.D., is the CEO of ET-Trends, a consulting, packaging design, and IP firm specializing in emerging technologies. The firm's projects include novel materials and packages and processes for MEMS, MOEMS, and optoelectronics. Dr. Gilleo is a member of IEEE and IMAPS, and he is also Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). He has been actively involved in the development of new products for 30 years and is an inventor in circuitry, electronics materials, and packaging. Dr. Gilleo has 30 U.S. patents, and his products have received three R&D 100 Awards. Dr. Gilleo resides in Warwick, Rhode Island.
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Vendeur : ThriftBooks-Dallas, Dallas, TX, Etats-Unis
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Vendeur : moluna, Greven, Allemagne
Etat : New. While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of ap. N° de réf. du vendeur 897378112
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Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
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Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
Etat : As New. Unread book in perfect condition. N° de réf. du vendeur 3226211
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Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
Etat : New. N° de réf. du vendeur 3226211-n
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Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Buch. Etat : Neu. Neuware - While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. N° de réf. du vendeur 9780071455565
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