Introduction to System-on-package Sop: Miniaturization of the Entire System - Couverture rigide

Tummala, Rao

Couverture rigide

ISBN 10 : 0071459065 ISBN 13 : 9780071459068

Editeur : McGraw-Hill Professional, 2008

Synopsis

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

A propos du livre

À propos de l?auteur

Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.

Détails de l'édition

• Éditeur: McGraw-Hill Professional
• Date d'édition: 2008
• Langue: anglais
• ISBN 10: 0071459065
• ISBN 13: 9780071459068
• Reliure: Relié
• Numéro d'édition: 1
• Nombre de pages: 785
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible