Introduction to System-on-package Sop: Miniaturization of the Entire System - Couverture rigide

Tummala, Rao

 
9780071459068: Introduction to System-on-package Sop: Miniaturization of the Entire System
Couverture rigide
ISBN 10 : 0071459065 ISBN 13 : 9780071459068
Editeur : McGraw-Hill Professional, 2008

Synopsis

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
McGraw-Hill Professional
Date d'édition
2008
Langue
anglais
ISBN 10 
0071459065
ISBN 13 
9780071459068
Reliure
Relié
Numéro d'édition
1
Nombre de pages
785
Coordonnées du fabricant
non disponible
Personne responsable
non disponible