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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability - Couverture souple

Livre 110 sur 203: Woodhead Publishing Series in Electronic and Optical Materials
 
9780081020944: Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability
Couverture souple
ISBN 10 : 0081020945 ISBN 13 : 9780081020944
Editeur : Woodhead Publishing, 2018

Synopsis

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l'auteur

Dr. Katsuaki Suganama graduated from Tohoku University Faculty of Engineering in 1977, and since then has had a highly influential role within the fields of Physical properties of metals/Metal-base materials, Inorganic industrial materials, Metal making/Resorce production engineering, Material processing/Microstructural control engineering, Structural/Functional materials, Composite materials/Surface and interface engineering, Inorganic materials/Physical properties, Electronic materials/Electric materials.

He has published several academic papers and books during his career, and has won many prestigious awards such as Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics and the Richard M. Fularth Pacific Award. He has worked as Professor at Osaka University Institute of Scientific and Industrial Research since 1996.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Woodhead Publishing
Date d'édition
2018
Langue
anglais
ISBN 10 
0081020945
ISBN 13 
9780081020944
Reliure
Broché
Nombre de pages
240
Éditeur
Suganuma Katsuaki
Coordonnées du fabricant
non disponible
Personne responsable
non disponible