Reliability and Failure of Electronic Materials and Devices - Couverture rigide

Ohring, Milton; Kasprzak, Lucian

Couverture rigide

ISBN 10 : 0120885743 ISBN 13 : 9780120885749

Editeur : Academic Press Inc, 2014

Synopsis

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. * Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints* New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections* New chapter on testing procedures, sample handling and sample selection, and experimental design* Coverage of new packaging materials, including plastics and composites

A propos du livre

À propos de l?auteur

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise. Lucian A. Kasprzak received a BS in physics in 1965 from Stevens Institute of Technology and then joined IBM. As Failure Analysis Engineer, he developed electrical and physical failure analysis techniques for new products. Ultimately, he developed a course on failure analysis for engineers and technicians and prepared a 500 page Failure Analysis Manual for use within IBM. While at IBM he pursued an MS in physics at Syracuse University, graduating in 1970. At that time he was awarded an IBM Resident Fellowship to pursue a Doctorate. He received his Ph.D. in materials science from Stevens Institute of Technology in 1972. His Doctoral Thesis Advisory Committee was multi-disciplined (materials science, physics and electrical engineering) solid state technology. His Doctoral Thesis was "Charge Storage on Small Metal Particles in an MAOS Structure". He hasheld positions as Senior Engineer, Memory Reliability Engineering Manager, Functional Manager of Assurance for Large Memory Systems, Manager of Memory Technology, Program Manager of System Technology Support, and Program Manager for Technical Professional Relations. In 1988 he became an IEEE Fellow "For contributions to very-large-scale-integrated devices through the integration of reliability physics with process development." From 1992 to 1996, he was Associate Professor of Physics and Engineering Science at Franciscan University while on leave of absence form IBM Corporation. He retired from IBM In 1995. In 1996 he joined Sterling Diagnostic Imaging as Reliability Manager for the Direct Radiography Program, a digital x-ray detector using Selenium and TFTs to replace x-ray film. He became Director of Reliability at Direct Radiography Corp. in 1997. Early in 2001 he became an independent Reliability Consultant. Dr. Kasprzak has 3 patents and some 40 publications. He has received the Benefactors Award from Franciscan University and is listed in American Men and Women of Science, Who's Who in America, and Who's Who in Science and Engineering. He is also a member of the American Physical Society.

Détails de l'édition

• Éditeur: Academic Press Inc
• Date d'édition: 2014
• Langue: anglais
• ISBN 10: 0120885743
• ISBN 13: 9780120885749
• Reliure: Relié
• Numéro d'édition: 2
• Nombre de pages: 758
• Coordonnées du fabricant: non disponible
• Personne responsable: Yeepin GmbH; 492000000000; sunshine12232@outlook.com; ; Alleestr.11; Kaiserslautern; Rheinland-Pfalz; 67655; Allemagne