Three-Dimensional Integrated Circuit Design - Couverture rigide

Pavlidis, Vasilis F.

Couverture rigide

ISBN 10 : 0123743435 ISBN 13 : 9780123743435

Editeur : Morgan Kaufmann Publishers In, 2008

Synopsis

With vastly increased complexity and functionality in the 'nanometer era' (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.

A propos du livre

À propos de l?auteur

Vasilis F. Pavlidis received the B.S. and M.Eng. in electrical and computer engineering from the Democritus University of Thrace, Xanthi, Greece, in 2000 and 2002, respectively. He received the M.Sc. and Ph.D. degrees from, University of Rochester, Rochester, NY in 2003 and 2008, respectively. From 2000 to 2002, he was with INTRACOM S.A. Athens, Greece. In summer of 2007, he was with Synopsys Inc. Mountain View, California. His current research interests are in the area of interconnect modeling, 3-D integration, networks-on-chip, and related design issues in VLSI.

Détails de l'édition

• Éditeur: Morgan Kaufmann Publishers In
• Date d'édition: 2008
• Langue: anglais
• ISBN 10: 0123743435
• ISBN 13: 9780123743435
• Reliure: Relié
• Nombre de pages: 336
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible