Reliability Prediction from Burn-In Data Fit to Reliability Models - Couverture souple

Bernstein, Joseph

Couverture souple

ISBN 10 : 0128007478 ISBN 13 : 9780128007471

Editeur : Academic Press Inc, 2014

Synopsis

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design.

A propos du livre

À propos de l'auteur

Joseph B. Bernstein is Professor of Electrical Engineering at Ariel University, Ariel, Israel. He received his PhD from MIT, Cambridge, MA, USA, and has previously worked as a Professor at Bar Ilan University, Israel, and at the University of Maryland and the MIT Lincoln Laboratory. He has co-authored two books.

Détails de l'édition

• Éditeur: Academic Press Inc
• Date d'édition: 2014
• Langue: anglais
• ISBN 10: 0128007478
• ISBN 13: 9780128007471
• Reliure: Broché
• Nombre de pages: 108
• Coordonnées du fabricant: non disponible
• Personne responsable: Yeepin GmbH; 492000000000; sunshine12232@outlook.com; ; Alleestr.11; Kaiserslautern; Rheinland-Pfalz; 67655; Allemagne