Semiconductor Manufacturing Technology - Couverture souple

Quirk, Michael; Serda, Julian

Couverture souple

ISBN 10 : 0130815209 ISBN 13 : 9780130815200

Editeur : Pearson, 2000

Synopsis

For the introductory course in Semiconductor Manufacturing Technology.

This text introduces the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra-large-scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications.

A propos du livre

À propos de la quatrième de couverture

This book is written for students in two- and four-year technology programs at community colleges and universities. Chapters are organized around the broad technologies applicable to semiconductor manufacturing.

Chapters 1 to 8 present fundamental technical information relevant to semiconductor manufacturing. Chapter 9 presents a process model overview with a general flowchart that links the major areas in wafer fabrication. Chapters 10 to 19 cover each of the major processes. Each process chapter concludes with a summary of quality measures and troubleshooting issues to provide the student with practical challenges encountered during wafer fabrication. Chapter 20 provides an overview of the back-end process for IC assembly and packaging.

Academic and industry reviewers have applauded this book as the most comprehensive and up-to-date text currently available in the market.

Détails de l'édition

• Éditeur: Pearson
• Date d'édition: 2000
• Langue: anglais
• ISBN 10: 0130815209
• ISBN 13: 9780130815200
• Reliure: Broché
• Nombre de pages: 666
• Coordonnées du fabricant: non disponible
• Personne responsable: Riccardo Bacigalupo; riccardo.bacigalupo@sanoma.it; ; Sanoma Italia Via Arconati, 1 �; Milano; 20135; Italie