Materials for High-Temperature Semiconductor Devices - Couverture souple

National Research Council; Division On Engineering And Physical Sciences; National Materials Advisory Board; Commission On Engineering And Technical Systems; Committee On Materials For High-Temperature Semiconductor Devices

Couverture souple

ISBN 10 : 0309053358 ISBN 13 : 9780309053358

Editeur : National Academies Press, 1995

Synopsis

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

A propos du livre

À propos de l'auteur

Committee on Materials for High-Temperature Semiconductor Devices, Commission on Engineering and Technical Systems, National Research Council

Détails de l'édition

• Éditeur: National Academies Press
• Date d'édition: 1995
• Langue: anglais
• ISBN 10: 0309053358
• ISBN 13: 9780309053358
• Reliure: Broché
• Nombre de pages: 136
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible