Innovative Processes and Materials in Additive Manufacturing - Couverture souple

Couverture souple

ISBN 10 : 0323860117 ISBN 13 : 9780323860116

Editeur : Woodhead Publishing, 2022

Synopsis

Innovative Processes and Materials in Additive Manufacturing explains game-changing interdisciplinary applications of recent research breakthroughs in additive manufacturing technology. The number of research publications addressing additive manufacturing has soared in recent years as a range of disciplines explore the possibilities that this technology can provide. This book acts as a bridge between this high-level research and the large number of academics and practitioners looking to additive manufacturing for innovative solutions, providing them with practical and approachable information. Applications in aerospace, automotive, medical, construction, and food industries are addressed, featuring technical details that will help successful implementation.

This unique book also provides broad coverage of the theory behind this emerging technology, including material development, as well as the technical details required for readers to investigate the novel applications of the involved methods for themselves.

A propos du livre

À propos des auteurs

Sunpreet Singh is researcher in NUS Nanoscience & Nanotechnology Initiative (NUSNNI). He has received Ph.D in Mechanical Engineering from Guru Nanak Dev Engineering College, Ludhiana, India. He has contributed extensively in additive manufacturing literature with publications appearing in Journal of Manufacturing Processes, Composite Part: B, Rapid Prototyping Journal, Journal of Mechanical Science and Technology, Measurement, International Journal of Advance Manufacturing Technology, and Journal of Cleaner Production. He has authored more than 150+ research papers and book chapters. He is also editor of 3 books- "Current Trends in Bio-manufacturing", "3D Printing in Biomedical Engineering", and "Biomaterials in Orthopaedics and Bone Regeneration - Design and Synthesis". He is also guest editor of several journals- special issue of "Functional Materials and Advanced Manufacturing", Facta Universitatis, series: Mechanical Engineering (Scopus Indexed), Materials Science Forum (Scopus Indexed), and special issue on "Metrology in Materials and Advanced Manufacturing", Measurement and Control (SCI indexed), Materials, Sustainability (MDPI).

Chander Prakash is Pro-Vice Chancellor, University Centre for Research and Development, Chandigarh University, Mohali, Punjab, 140413, India. His area of research is biomaterials, rapid prototyping & 3-D printing, advanced manufacturing, modelling, simulation, and optimization. He has more than 11 years of teaching experience and 6 years research experience. He has contributed extensively to the world in the Titanium and Magnesium based implant academic literature.

Seeram Ramakrishna is the Director of the Center for Nanofibres and Nanotechnology at the National University of Singapore (NUS), which is ranked among the top 20 universities in the world. He is regarded as the modern father of electrospinning. He is an elected Fellow of UK Royal Academy of Engineering (FREng); Singapore Academy of Engineering; Indian National Academy of Engineering; and ASEAN Academy of Engineering & Technology. He is an elected Fellow of the International Union of Societies of Biomaterials Science and Engineering (FBSE); Institution of Engineers Singapore; ISTE, India; Institution of Mechanical Engineers and Institute of Materials, Minerals & Mining, UK; and American Association of the Advancement of Science; ASM International; American Society for Mechanical Engineers; American Institute for Medical & Biological Engineering, USA. He is an editor of Elsevier journal Current Opinion in Biomedical Engineering.

Détails de l'édition

• Éditeur: Woodhead Publishing
• Date d'édition: 2022
• Langue: anglais
• ISBN 10: 0323860117
• ISBN 13: 9780323860116
• Reliure: Broché
• Nombre de pages: 326
• Éditeur: Singh, Prakash, Ramakrishna
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible