FinFET/GAA Modeling for IC Simulation and Design - Couverture souple

Chauhan

Couverture souple

ISBN 10 : 0323957293 ISBN 13 : 9780323957298

Editeur : Academic Press, 2024

Synopsis

FinFET/GAA Modeling for IC Simulation and Design: Using the BSIM-CMG Standard, Second Edition is the first to book to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture as now enabled by the approved industry standard. The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, thus providing a step-by-step approach for the efficient extraction of model parameters.

With this book, users will learn Why you should use FinFET, The physics and operation of FinFET Details of the FinFET standard model (BSIM-CMG), Parameter extraction in BSIM-CMG FinFET circuit design and simulation, and more.

• Authored by the lead inventor and developer of FinFET and developers of the BSIM-CMG standard model, providing an expert's insight into the specifications of the standard
• A new edition of the original groundbreaking book on the industry-standard FinFET model-BSIM-CMG

New to This Edition

• Includes a new chapter providing a comprehensive introduction to GAAFET, including motivations, device concepts, structure, benefits, and the industry standard GAAFET model
• Covers the most recent developments in the BSIM-CMG model
• Presents an updated RF modeling of FinFET using the BSIM-CMG model including parameter extraction
• Includes a new chapter on cryogenic modeling

A propos du livre

À propos des auteurs

Yogesh Singh Chauhan is a Chair Professor in the Department of Electrical Engineering at the Indian Institute of Technology Kanpur, India. He is the developer of several industry standard models: ASM-HEMT, BSIM-BULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4 and BSIM-SOI models. His research group is involved in developing compact models for GaN transistors, FinFET, nanosheet/gate-all-around FETs, FDSOI transistors, negative capacitance FETs and 2D FETs. His research interests are RF characterization, modeling, and simulation of semiconductor devices.

Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California Berkeley, United States. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica. He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley's highest honor for teaching - the Berkeley Distinguished Teaching Award.

Sayeef Salahuddin is the TSMC Distinguished Chair Professor at the University of California, Berkeley He received the Presidential Early Career Award for Scientists and Engineers by President Obama among several other early career awards from multiple federal agencies. He also received the IEEE Andrew S Grove Award for his pioneering work in ferroelectric negative capacitance and its incorporation into the most advanced DRAM memory and back-end capacitors. He is a Fellow of the IEEE, APS and AAAS and is the editor-in-chief of the IEEE Electron Devices Letters.

Détails de l'édition

• Éditeur: Academic Press
• Date d'édition: 2024
• Langue: anglais
• ISBN 10: 0323957293
• ISBN 13: 9780323957298
• Reliure: Broché
• Numéro d'édition: 2
• Nombre de pages: 324
• Coordonnées du fabricant: Academic Press; https://shop.elsevier.com/; ; 230 PARK AVENUE, SUITE 800; NY; NY; 10169; Etats-Unis
• Personne responsable: Yeepin GmbH; 492000000000; sunshine12232@outlook.com; ; Alleestr.11; Kaiserslautern; Rheinland-Pfalz; 67655; Allemagne