Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - Couverture souple

Wei, Xing-Chang

 
9780367573669: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Couverture souple
ISBN 10 : 0367573660 ISBN 13 : 9780367573669
Editeur : CRC Press, 2020

Synopsis

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi'an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China's Ministry of Education.

His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
CRC Press
Date d'édition
2020
Langue
anglais
ISBN 10 
0367573660
ISBN 13 
9780367573669
Reliure
Broché
Nombre de pages
340
Coordonnées du fabricant
non disponible
Personne responsable
gpsr@libri.de
gpsr@libri.de

Europaallee 1
Bad Hersfeld
36244
Allemagne

Autres éditions populaires du même titre

9781138033566: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Edition présentée

ISBN 10 :  1138033561 ISBN 13 :  9781138033566
Editeur : CRC Press, 2017
Couverture rigide