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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Edité par
Taylor & Francis Ltd, 2024
ISBN 10 : 0367635887
ISBN 13 : 9780367635886
Neuf
Paperback / softback
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
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Paperback / softback. Etat : New. New copy - Usually dispatched within 4 working days. 748. N° de réf. du vendeur B9780367635886
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Vendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. N° de réf. du vendeur 409308262
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Edité par
CRC Press, 2024
ISBN 10 : 0367635887
ISBN 13 : 9780367635886
Ancien ou d'occasion
Couverture souple
Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Edité par
CRC Press, 2024
ISBN 10 : 0367635887
ISBN 13 : 9780367635886
Ancien ou d'occasion
Couverture souple
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
impression à la demandeVendeur : Revaluation Books, Exeter, Royaume-Uni
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Paperback. Etat : Brand New. 406 pages. 9.18x6.12x9.21 inches. In Stock. This item is printed on demand. N° de réf. du vendeur __0367635887
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Vendeur : Books Puddle, New York, NY, Etats-Unis
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Vendeur : Biblios, Frankfurt am main, HESSE, Allemagne
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Edité par
Taylor & Francis Ltd, London, 2024
ISBN 10 : 0367635887
ISBN 13 : 9780367635886
Neuf
Paperback
Vendeur : AussieBookSeller, Truganina, VIC, Australie
Évaluation du vendeur 5 sur 5 étoiles
Paperback. Etat : new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. N° de réf. du vendeur 9780367635886
Quantité disponible : 1 disponible(s)