Solder Joint Reliability Prediction for Multiple Environments - Couverture rigide

Perkins, Andrew E.; Sitaraman, Suresh K.

Couverture rigide

ISBN 10 : 0387793933 ISBN 13 : 9780387793931

Editeur : Springer-Verlag New York Inc., 2008

Synopsis

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Détails de l'édition

• Éditeur: Springer-Verlag New York Inc.
• Date d'édition: 2008
• Langue: anglais
• ISBN 10: 0387793933
• ISBN 13: 9780387793931
• Reliure: Relié
• Nombre de pages: 208
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne