A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve- ment will span half a century.
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Vendeur : World of Books (was SecondSale), Montgomery, IL, Etats-Unis
Hardback. Etat : Fair. Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech- nology to produce state-of-the-art miniaturized electronic products. How- ever, in order to take advantage of this technology, a complete infrastruc- ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor- mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC), the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im- plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology. N° de réf. du vendeur 00109471444
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Vendeur : Bookmans, Tucson, AZ, Etats-Unis
Hardcover. Etat : Acceptable. Highlighting/Underlining/Notes etc. Satisfaction 100% guaranteed. N° de réf. du vendeur mon0002769323
Quantité disponible : 1 disponible(s)
Vendeur : Anybook.com, Lincoln, Royaume-Uni
Etat : Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1350grams, ISBN:9780412129216. N° de réf. du vendeur 8605110
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Vendeur : DeckleEdge LLC, Albuquerque, NM, Etats-Unis
Etat : New. N° de réf. du vendeur CU132
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Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
Etat : As New. Unread book in perfect condition. N° de réf. du vendeur 675742
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Vendeur : Revaluation Books, Exeter, Royaume-Uni
Hardcover. Etat : Brand New. 2nd edition. 772 pages. 9.25x6.50x1.50 inches. In Stock. This item is printed on demand. N° de réf. du vendeur __0412129213
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Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
Etat : New. N° de réf. du vendeur 675742-n
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Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-Unis
Hardcover. Etat : new. Hardcover. This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The chapters are a "walk-through" of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues current to the industry. A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. it is probably also of value to know the background of the individual who is commenting on the work. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9780412129216
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Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
Etat : New. N° de réf. du vendeur 675742-n
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Vendeur : moluna, Greven, Allemagne
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, h. N° de réf. du vendeur 5914164
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