Articles liés à Solder Joint Reliability: Theory and Applications
Synopsis
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me- chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica- tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo- metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
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Solder Joint Reliability: Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
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Hardcover. Etat : Good. N° de réf. du vendeur mon0003880299
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Solder Joint Reliability: Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Ancien ou d'occasion
Couverture rigide
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Solder Joint Reliability: Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Neuf
Couverture rigide
Vendeur : BennettBooksLtd, San Diego, NV, Etats-Unis
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hardcover. Etat : New. In shrink wrap. Looks like an interesting title! N° de réf. du vendeur Q-0442002602
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Solder Joint Reliability: Theory and Applications
Edité par
Springer, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
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Edition originale
Vendeur : Hard To Find Editions, Bristol, AVON, Royaume-Uni
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Hardcover. Etat : Very Good. 1st Edition. This book has been read, but is in a clean and very good condition. All pages are intact with no highlighting or writing contained within. The spine remains undamaged with tight binding. Fast dispatch within and from the UK. 100% money back guarantee. N° de réf. du vendeur ABE-1677440319246
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SOLDER JOINT REALIABILITY
Vendeur : LIBRERIA LEA+, Santiago, RM, Chili
Évaluation du vendeur 4 sur 5 étoiles
Dura. Etat : New. Etat de la jaquette : Nuevo. No Aplica (illustrateur). 0. Predicting and engineering reliable solder joints in today?s complex electronic packaging and interconnection is both critical and extremely difficult. Compoundig this difficulty is that the latest information on how to prevent solder failure has been available only from proceedings of many scattered conferences, symposia, and workshops. This as well as immensely practical, this guide compiles state-of-the-art techniques spanning the full scope of solder reliability concerns. It offers contributions from a widerange of experts who address their respective specialties covering the most advanced research and solutions technology in the field today. You?ll the brains of industry leaders in discussions of the underlying science and practical consideration of every primary cause of solder failure. Progressing from solder joint formation to long-term reliability, the contributors explain how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Failure mechanisms of bulk solders and joints under mechanical, isothermal, and thermal conditions are explored in depth. 1000 gr. Libro. N° de réf. du vendeur 9780442002602LEA1121
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Solder Joint Reliability: Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Neuf
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Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
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Etat : New. N° de réf. du vendeur ABLIING23Feb2215580211532
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Solder Joint Reliability : Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Neuf
Couverture rigide
Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
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Etat : New. N° de réf. du vendeur 683176-n
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Solder Joint Reliability: Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Neuf
Couverture rigide
Vendeur : California Books, Miami, FL, Etats-Unis
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Etat : New. N° de réf. du vendeur I-9780442002602
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Solder Joint Reliability: Theory and Applications
Edité par
Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Neuf
Couverture rigide
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Etat : New. In. N° de réf. du vendeur ria9780442002602_new
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Solder Joint Reliability (Hardcover)
Edité par
Kluwer Academic Publishers Group, Dordrecht, 1991
ISBN 10 : 0442002602
ISBN 13 : 9780442002602
Neuf
Couverture rigide
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Hardcover. Etat : new. Hardcover. Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9780442002602
Quantité disponible : 1 disponible(s)