This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Vendeur : ThriftBooks-Atlanta, AUSTELL, GA, Etats-Unis
Hardcover. Etat : Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. N° de réf. du vendeur G0442014414I4N00
Quantité disponible : 1 disponible(s)
Vendeur : GridFreed, San Diego, CA, Etats-Unis
Hardcover. Etat : New. In shrink wrap. N° de réf. du vendeur 20-11566
Quantité disponible : 1 disponible(s)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Etat : New. In. N° de réf. du vendeur ria9780442014414_new
Quantité disponible : Plus de 20 disponibles
Vendeur : moluna, Greven, Allemagne
Gebunden. Etat : New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. N° de réf. du vendeur 458435639
Quantité disponible : Plus de 20 disponibles
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Buch. Etat : Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. N° de réf. du vendeur 9780442014414
Quantité disponible : 2 disponible(s)