Advanced Materials for Interconnections: Proceedings of Symposium J on Advanced Materials for Interconnections of the 1996 E-Mrs Spring Conference, Strasbourg, France, June 4-7, 1996 - Couverture rigide

Gessner, Th.

 
9780444205070: Advanced Materials for Interconnections: Proceedings of Symposium J on Advanced Materials for Interconnections of the 1996 E-Mrs Spring Conference, Strasbourg, France, June 4-7, 1996
Couverture rigide
ISBN 10 : 0444205071 ISBN 13 : 9780444205070
Editeur : Elsevier Science Ltd, 1997

Synopsis

The conference "Advanced Materials for Interconnections" took place in Strasbourg on 4-7 June 1996 hosted by the EMRS Society. Based on the recent trends in microelectronics the main topics of the conference were new materials for interconnects like special aluminum alloys, tungsten and copper as well as low k dielectric materials.64 Papers were presented at the conference and 51 of these are contained as full length papers within this volume of Microelectronic Engineering.The proceedings are divided into 5 chapters. Chapter 1 related to Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. Chapter 2, Process Integration, discusses multilevel interconnect, study on thin-film SOI devices, wet cleanings, influence of material characteristics and deposition processes, copper contamination and metallization, plasma behaviour, CMP processes, sub-micron inverse metallisation, interconnect formation and mechanical polishing investigations. Chapter 3 covers Barriers, and chapter 4 studies, evaluates and monitors Dielectrics. The final chapter looks at modelling comparisons.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

The conference "Advanced Materials for Interconnections" took place in Strasbourg on 4-7 June 1996 hosted by the EMRS Society. Based on the recent trends in microelectronics the main topics of the conference were new materials for interconnects like special aluminum alloys, tungsten and copper as well as low k dielectric materials.

64 Papers were presented at the conference and 51 of these are contained as full length papers within this volume of Microelectronic Engineering.

The proceedings are divided into 5 chapters. Chapter 1 related to Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. Chapter 2, Process Integration, discusses multilevel interconnect, study on thin-film SOI devices, wet cleanings, influence of material characteristics and deposition processes, copper contamination and metallization, plasma behaviour, CMP processes, sub-micron inverse metallisation, interconnect formation and mechanical polishing investigations. Chapter 3 covers Barriers, and chapter 4 studies, evaluates and monitors Dielectrics. The final chapter looks at modelling comparisons.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Elsevier Science Ltd
Date d'édition
1997
Langue
anglais
ISBN 10 
0444205071
ISBN 13 
9780444205070
Reliure
Relié
Nombre de pages
460
Coordonnées du fabricant
non disponible
Personne responsable
Barbara Criscuolo
b.criscuolo@lswr.it

Via Spadolini, 7
Milano
20141
Italie