The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies.
The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be: design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Krzysztof (Kris) Iniewski, PhD, manages R&D developments at Redlen Technologies. He is also an executive director at CMOS Emerging Technologies. A former associate professor in the Electrical Engineering and Computer Engineering and Computer Engineering Department at the University of Alberta, Dr. Iniewski's Main research interest is in IC design for medical and networking applications.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
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Hardcover. Etat : Very Good. 1. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting. N° de réf. du vendeur 0470900059-11-1
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Hardcover. Etat : new. Hardcover. The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors. CMOS technology is the dominant technology for fabricating integrated circuits (ICs or chips). It is reliable, manufacturable, low power, low cost, and most importantly, scalable. This authoritative CMOS circuit design book covers advanced circuits for emerging technologies, including digital VLSI, analog VLSI and VSLI memories. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9780470900055
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Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlande
Etat : New. CMOS technology is the dominant technology for fabricating integrated circuits (ICs or chips). It is reliable, manufacturable, low power, low cost, and most importantly, scalable. This authoritative CMOS circuit design book covers advanced circuits for emerging technologies, including digital VLSI, analog VLSI and VSLI memories. Num Pages: 632 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 163 x 37. Weight in Grams: 986. . 2012. 1st Edition. Hardcover. . . . . N° de réf. du vendeur V9780470900055
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Vendeur : Books Puddle, New York, NY, Etats-Unis
Etat : New. pp. xvi + 615 Index 1st Edition. N° de réf. du vendeur 263024075
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