Lead-Free Solders: Materials Reliability for Electronics - Couverture rigide

Couverture rigide

ISBN 10 : 0470971827 ISBN 13 : 9780470971826

Editeur : John Wiley & Sons Inc, 2012

Synopsis

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:

• Phase diagrams and alloy development
• Effect of minor alloying additions
• Composite approaches including nanoscale reinforcements
• Mechanical issues affecting reliability
• Reliability under impact loading
• Thermomechanical fatigue
• Chemical issues affecting reliability
• Whisker growth
• Electromigration
• Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

A propos du livre

À propos de l'auteur

K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.

Détails de l'édition

• Éditeur: John Wiley & Sons Inc
• Date d'édition: 2012
• Langue: anglais
• ISBN 10: 0470971827
• ISBN 13: 9780470971826
• Reliure: Relié
• Nombre de pages: 520
• Éditeur: Subramanian K.
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible