Semiconductor Packaging: A Multidisciplinary Approach - Couverture souple

Hanneman, Robert J.; Etc.

Couverture souple

ISBN 10 : 0471181234 ISBN 13 : 9780471181231

Editeur : John Wiley & Sons Inc, 1997

Synopsis

La création de produits électroniques efficaces et fiables implique l'interaction de l'ingénierie électrique, mécanique, des matériaux et de la fiabilité. Ce livre couvre tous les systèmes physiques, processus et matériaux auxquels un ingénieur d'emballage doit faire face et fournit tous les outils nécessaires pour surmonter un large éventail de problèmes et de problèmes.

A propos du livre

Quatrième de couverture

This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them.

In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors...

• Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more
• Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics
• Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade.

The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.

Biographie de l'auteur

ROBERT J. HANNEMANN, a Digital Corporate Consultant Engineer, is Director of Digital′s Mobile Systems Program.

ALLAN D. KRAUS is Professor of Electrical Engineering at the Naval Postgraduate School in Monterey, California.

MICHAEL PECHT is Director of the CALCE Center for Electronic Packaging and Professor at the University of Maryland.

Détails de l'édition

• Éditeur: John Wiley & Sons Inc
• Date d'édition: 1997
• Langue: anglais
• ISBN 10: 0471181234
• ISBN 13: 9780471181231
• Reliure: Broché
• Nombre de pages: 896
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible