Integrated Passive Component Technology - Couverture rigide

Couverture rigide

ISBN 10 : 0471244317 ISBN 13 : 9780471244318

Editeur : Wiley-IEEE Press, 2003

Synopsis

• This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
• Describes the processes available for creating integrated passives, measuring their properties, and applying them.
• Brings reader up to date in a fast-moving technology.
• Enables reader to implement the technology into a manufacturing environment.
• Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
• Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.

A propos du livre

À propos de l?auteur

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

Détails de l'édition

• Éditeur: Wiley-IEEE Press
• Date d'édition: 2003
• Langue: anglais
• ISBN 10: 0471244317
• ISBN 13: 9780471244318
• Reliure: Relié
• Nombre de pages: 400
• Éditeur: Ulrich Richard K., Schaper Leonard W.
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible