Wavelet theory is new to mathematics and has wide applications in science engineering. Because it has the potential to become an important tool in electronic applications such as packaging, interconnections, antenna theory, and wireless communications, engineers are preparing to enter the field in a virtual flood. While wavelets have been extensively covered from a mathematician′s point of view, this timely text bridges the gap between mathematical theory and engineering applications to help engineers exploit the advantages of wavelets.
Equally valuable as a beginning engineer′s guide or as a reference for experienced engineers and scientists, Wavelets in Electromagnetics and Device Modeling offers a quick introduction to the basics of wavelets and then, without overly complex or abstract mathematics, outlines applications of wavelets in real–world engineering problems. Aspects of wavelet theory covered include:
∗ Basic orthogonal wavelet theory, biorthogonal wavelets, weighted wavelets, interpolating wavelets, Green′s wavelets, and multiwavelets
∗ Special treatment of edges including the periodic wavelets, intervallic wavelets, and Malvar wavelets for the method of moments (MoM)
∗ Derivation of positive sampling functions and their biorthogonal counterparts employing Daubechies wavelets
∗ Using the sampling biorthogonal time domain (SBTD) method to improve the finite difference time domain (FDTD) scheme
∗ Applications in the edge–based finite element method (EEM)
∗ Advanced topics such as scattering and radiation, 3–D rough surface scattering, packaging, and interconnects
∗ Semiconductor device modeling using wavelets
Other valuable features of the book include detailed discussions of numerical procedures to help engineers develop their own algorithms and computer codes. Providing physical insight rather than rigorous mathematics, Wavelets in Electromagnetics and Device Modeling will launch engineers into the emerging new field of wavelets and their exciting new applications.
GEORGE W. PAN, PhD, is Professor of Electrical Engineering and Director of the Electronic Packaging Lab at Arizona State University. He was previously a professor of electrical engineering and director of the Signal Propagation Lab at the University of Wisconsin–Milwaukee. Professor Pan is a senior member of the IEEE and has served as a technical consultant for Boeing Aerospace Co., Cray Research, Mayo Foundation, and other corporations. He is a contributing author to Modeling and Simulation of High Speed VLSI Interconnects.
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