Ic Component Sockets - Couverture rigide

Liu, Weifeng; Pecht, Michael G.

Couverture rigide

ISBN 10 : 0471460508 ISBN 13 : 9780471460503

Editeur : Wiley-Interscience, 2004

Synopsis

A broad and practical reference to IC socket technology

The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges.

Topics of interest include:
* Socket design and contact technologies
* Performance characteristics and material properties
* Contact failure modes and mechanisms
* Qualification testing conditions
* Qualification sequences and setup
* IEEE prediction methodology
* Theoretical calculation of contact reliability


Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.

A propos du livre

À propos de l'auteur

WEIFENG LIU, PHD, is an Interconnect Specialist at the Business Critical Systems Organization of Hewlett Packard Company. A member of IMAPS and IEEE, he has published numerous papers and has one patent pending.

MICHAEL G. PECHT, PHD, is a professional engineer and a Fellow of IEEE and ASME. He is the founder and director of the CALCE Electronic Products and Systems Center at the University of Maryland. Among the awards he has received are the 3M Research Award, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in the field. He has written sixteen books on electronic product development, served as chief editor of the IEEE Transactions on Reliability, and served on the Advisory Board of IEEE Spectrum.

Détails de l'édition

• Éditeur: Wiley-Interscience
• Date d'édition: 2004
• Langue: anglais
• ISBN 10: 0471460508
• ISBN 13: 9780471460503
• Reliure: Relié
• Nombre de pages: 232
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible