Soldering Processes and Equipment - Couverture rigide

 
9780471591672: Soldering Processes and Equipment
Couverture rigide
ISBN 10 : 047159167X ISBN 13 : 9780471591672
Editeur : Wiley-Interscience, 1993

Synopsis

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

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À propos de l'auteur

Michael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Wiley-Interscience
Date d'édition
1993
Langue
anglais
ISBN 10 
047159167X
ISBN 13 
9780471591672
Reliure
Relié
Nombre de pages
312
Éditeur
Pecht Michael G.
Coordonnées du fabricant
non disponible
Personne responsable
non disponible